APPLICATION GUIDE

The APPLICATION GUIDE supports your everyday work with Hercules^® and plasma etch and deposition processes.

Troubleshooting is best approached from a process point of view. Process problems may be indicated by test wafers, CDs, yield, or plasma parameters deviations.

PROCESS FAULT - WHAT NOW?	CONDITIONING GUIDE
The application guide supports your top-down analysis starting at a rough pre-selection on wether the issue occurs on: Only one product all the time Only at one chamber and all products All chambers and all products Deviations only at the first wafers of a lot (Please click on the left site.)	This guide will show you the advantages of using plasma parameters for the chamber conditioning and give suitable application examples. It will help you to efficiently perform the conditioning and matching procedure and properly respond to problems.

PROCESS FAULT - WHAT NOW?

CONDITIONING GUIDE

The application guide supports your top-down analysis starting at a rough pre-selection on wether the issue occurs on:

Only one product all the time
Only at one chamber and all products
All chambers and all products
Deviations only at the first wafers of a lot
(Please click on the left site.)

This guide will show you the advantages of using plasma parameters for the chamber conditioning and give suitable application examples.

It will help you to efficiently perform the conditioning and matching procedure and properly respond to problems.

Please note the Disclaimer.

For additional questions or other problems, please contact Plasmetrex headquarters by:

phone: +49 30 63 92 50 44

To find your local representative, please visit: Contact us.