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    PLASMA SCHOOL FOR SEMICONDUCTOR MANUFACTURING

    This course provides knowledge on plasma principles and capability of semiconductor manufacturing technologies.

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    Location: Courses at Customer Site on Request

    • 10 - 20 participants
    • Courses on demand
    • Technician and engineer courses
    Please contact us
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    Location: Courses in Berlin

    • RF Technology for Plasma Applications
    • Plasma School for Semiconductor Manufacturing
    • Selected special courses

    Next date for Plasma School at Plasmetrex' headquarter
    Plasma School for Semiconductor Manufacturing

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    Estimated Durations:

    • RF Technology for Plasma Applications: 12 hours

    • Plasma School for Semiconductor Manufacturing 
      • Plasma Physics Fundamentals: 10 h
      • Process Fundamentals & Control: 5+4 h
      • Equipment
        • Plasma Etch Tools: 4 h
        • Sputtering: 3 h
        • Plasma Deposition Tools: 2 h
    • Advanced Courses
        • E-Chuck: 4 hours
        • Arcing and charging: 2 h
        • Conditioning and chamber matching: 8 h
        • Deep Reactive Ion Etching (Main focus: Bosch process) 12 h

    • Special Courses (chamber related):
        • Applied Materials® DPN
        • Applied Materials® DPS
        • Lam® (Novellus) SPEED®
        • Lam® (Novellus) Sequel®

    Course overview

    MODULE: PLASMA PHYSICS FUNDAMENTALS
    Plasma Physics Fundamentals
    • Elementary plasma physics
    • DC discharge
    • RF discharge
    • CCP - Capacitively Coupled Plasma
    • ICP / TCP® - Inductively Coupled Plasma
    • Electron Cyclotron Resonance
    • NLD - Neutral Loop Discharge
    • Remote and pulsed plasmas
    • RF power in plasma
    • Plasma process control in Fab
    • Methods of plasma diagnostics
    		 Example: Plasma Physics Fundamentals

    MODULE: EQUIPMENT
    Plasma Etch Tools

    Plasma Etch Tools

    • The plasma process, reactor types
    • Capacitively Coupled Plasma
    • MERIE reactors
    • Dual frequency reactors
    • Inductively Coupled Plasma ( ICP / TCP®)
    • Comparison of chamber types
    • Etch chemistry
    		 Example: Plasma Etch Tools



    Plasma Deposition Tools

    Plasma Deposition Tools

    • Sputtering cleaning
    • Sputter deposition
    • Plasma Enhanced Vapor Deposition
    • Nitridation (summary)
    		 Example: Plasma Deposition Tools

    MODULE: PROCESS FUNDAMENTALS
    Plasma Processes
     
    • Basics of plasma processing
    • Physical etching (Sputtering)
    • Etching: Chemistry, selectivity, and profiles
    • Limitations of plasma processes
    • Deposition
    • Chamber design
    • Preprocess faults
    • Cost control by quality and process management
    		 Process Fundamentals

    MODULE: PROCESS and EQUIPMENT INTERACTION
    Conditioning and Chamber Matching

    Conditioning and Chamber Matching

    • Motivation
    • Gas heating
    • Memory effects at chamber wall
    • Conditioning
    • Chamber matching
    		 Example: Conditiong and Chamber Matching



    Wafer Damaging, E-Chuck, and Arcing

    Wafer Damaging, E-Chuck, and Arcing

    • Wafer Charging and Arcing
    • The ElectroStatic Chuck
    • Thermal Conductivity in Thin Gases
    • ESC and Etch Process
    • Chamber Arcing and Particles
    • Specific Problems of Dielectric Wafers
    		 Example: Wafer Damaging, E-chuck, and Arcing



    Plasma Nitridation

    Other training modules

    • Plasma Nitridation of ultra thin SiO2 Films
    • Chamber related courses as for Applied Materials® DPS/DPS+ and DPN, Lam/Novellus® Speed® and Sequel®
    		 Example: Plasma Nitridation